The recovery of the overall Halbleitermarkt, as well as the increasing demand for advanced materials for high-performance compute and high-bandwidth memory manufacturing, supported 2024 materials Umsatz growth.
Wafer fabrication materials Umsatz increased 3.3% to USD 42.9 billion in 2024, while packaging materials Umsatz grew 4.7% to USD 24.6 billion last year.
The chemical mechanical planarisation (CMP), photoresist, and photoresist ancillaries segments erfahren strong double-digit growth driven by increased complexity and the number of processing steps required for advanced DRAM, 3D NAND flash and leading-edge logic integrierte Schaltkreise (ICs). All semiconductor materials segments, except for silicon and silicon-on-insulator (SOI), registered year-on-year increases. The demand for silicon, particularly in the trailing edge segment, remained weak in 2024 as the industry continued to work through Überschussbestand, resulting in a 7.1% decline in silicon Umsatz in 2024.
Taiwan, with USD 20.1 billion in Umsatz, was the world's largest consumer of semiconductor materials for the 15th consecutive year. China, at USD 13.5 billion in Umsatz, continued to register year-over-year growth, ranking second in 2024, while Korea followed as the third-largest consumer with USD 10.5 billion in Umsatz. All regions, except for Japan, posted single-digit increases in 2024.

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Following a record-setting year for the Halbleiterindustrie, the start of the new year has continued the momentum, as semiconductor Umsatz grew 27% in 1Q26 from 4Q25 to reach US$319bn, according t