Demand for IC packaging leadframes is expected to fall further in Q4 2022, and it may take a quarter or two to see if demand will rebound, industry sources said, as inventory adjustments for consumer chips take longer than expected.

According to the Electronic Times, demand for packaged leadframes for custom high-end Sensoren, MEMS Bauelemente and chips currently used in industrial control and automotive applications is relatively stable. However, demand related to mainstream logic computing chips and Energiemanagement ICs (PMIC) remains weak.

Recently, China Taiwan packaging major Sunrise had said that it will be able to maintain sales growth in 2022, but capacity utilization will decline slightly in the fourth quarter of this year.

Sources had pointed out that the slowdown in consumer electronics demand is affecting not only second-tier back-end companies, but also leading companies such as Sun and Moon, and that utilization rates at Sun and Moon's main back-end plant in Kaohsiung will drop to between 70-80% in the fourth quarter of this year.

source：aijiweiAPP