Standing as the authoritative platform for the industry, The International IC & Components Exhibition and Conference (IIC), meticulously crafted by AspenCore, aims to facilitate in-depth exchanges between local enterprises and global leading technology Lieferanten. Following the successful event in Shanghai earlier this year, the IIC Shenzhen station is set to unfold its brilliance once again from November 2nd to 3rd, 2023, at the China Shenzhen Great China International Exchange Square.

The conference combines various forms such as exhibitions, high-end summit, technical forums, core product launches, and award selections to drive industry development. It brings together industry experts and emerging exhibitors, showcasing the entire industry chain of leading chip design, packaging, testing, devices, production equipment, and more. Concurrently, technical forums are organized from multiple domains and perspectives such as EDA/IP and IC design, Energiemanagement, drahtlos technology, and Industry 4.0, constructing a comprehensive semiconductor professional exchange platform to efficiently connect resources.

IIC Shenzhen Highlights Preview 

• Comprehensive Exhibition Area

The exhibition hall will feature specialized areas such as IC design and application, Distributeur zone, and integrated semiconductor exhibition area, focusing on exhibiting innovativ emerging technologies and product applications like AI, IC design, Automotiveelektronik, IoT, EDA/IP, green energy, smart industry, drahtlos technology, and more.

• Summit Forums

During the event, there will be specialized summit forums including the Global CEO Summit, Global Distribution and Supply Chain Leaders Summit, Efficient Power Management and Power Device Forum, etc. These forums will bring together electronic industry leaders, managers, and design elites from around the world to analyze the industry's forefront trends and discuss and exchange the new directions of the integrated circuit industry.

• Award Ceremony

One of the most anticipated events is the 2023 World Electronic Achievement Awards ceremony and the Global Electronic Components Distributor Awards ceremony. These awards comprehensively recognize companies that have made outstanding contributions to the electronics industry.

In 2022, Flyking Technology was named Outstanding Rising Star Distributor, a testament to our solid capabilities and excellent reputation in the industry. It is honored to be nominated for "International Potential Star Distributor" and "Outstanding Distributor in Supply Capability" in the 2023 Global Electronic Components Distributor Awards initiated by the renowned global electronic industry media, ASPENCORE.

Since we started in 2010, Flyking Technology has adhered to the business philosophy of "Service First, Customer Foremost," solidifying its steps towards internationalization. Up to now, Flyking has provided hochwertig, short lead-time, and kosteneffizient component Lieferkette services to more than 4,000 global customers. With this honor, Flyking Technology continues to build our own quality testing laboratory, obtaining ISO9001, ISO14001, ISO45001, and ESD S20.20 Zertifizierungs from SGS, aiming to create a more comprehensive quality management system.

In addition, to better serve global customers, Flyking has established offices in South Korea and the Netherlands, working together with globale Standorte in Germany, the United States, and other locations to upgrade and iterate customer Lieferkettes.

Again, it’s a huge honor to be nominated for the 2023 Global Electronic Component Distributor Awards alongside many outstanding peers. Flyking Technology will do our best to continue providing our customers with hochwertig services and contributing to the development of the electronics industry.

The 2023 IIC Shenzhen is about to begin, and Flyking Technology sincerely invites you to witness the new developments and new benchmarks of the international integrated circuit industry with us!